System and Method for Portable Information Handling System Parallel-Wall Thermal Shield

ABSTRACT

An information handling system&#39;s thermal management is selectively altered by coupling a thermal barrier to the bottom surface of the information handling system chassis so that an air channel insulates against the passage of thermal energy from the bottom surface. A vent opening in a side of the thermal barrier allows airflow through the air channel to a vent opening of the information handling system. The airflow through the air channel cools the base of the thermal barrier so that an end user will experience reduced thermal energy if the information handling system rests on the end user, such as in the end user&#39;s lap.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is related to and claims the benefit of U.S.patent application Ser. No. 12/022,495 entitled “System and Method forManaging Portable Information Handling System Cooling” and naming ErickArsene Siba and Anil Damani as inventors and U.S. patent applicationSer. No. 12/058,691, entitled “System and Method for PortableInformation Handling System Thermal Shield” and naming Mark Rehmann,David McKinney and Anil Damani as inventors. All subject matter of U.S.patent application Ser. Nos. 12/022,495 and 12/058,691 are incorporatedherein by reference to the extent such subject matter is notinconsistent herewith.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates in general to the field of informationhandling system cooling, and more particularly to a system and methodfor a portable information handling system parallel-wall thermal shield.

2. Description of the Related Art

As the value and use of information continues to increase, individualsand businesses seek additional ways to process and store information.One option available to users is information handling systems. Aninformation handling system generally processes, compiles, stores,and/or communicates information or data for business, personal, or otherpurposes thereby allowing users to take advantage of the value of theinformation. Because technology and information handling needs andrequirements vary between different users or applications, informationhandling systems may also vary regarding what information is handled,how the information is handled, how much information is processed,stored, or communicated, and how quickly and efficiently the informationmay be processed, stored, or communicated. The variations in informationhandling systems allow for information handling systems to be general orconfigured for a specific user or specific use such as financialtransaction processing, airline reservations, enterprise data storage,or global communications. In addition, information handling systems mayinclude a variety of hardware and software components that may beconfigured to process, store, and communicate information and mayinclude one or more computer systems, data storage systems, andnetworking systems.

When information handling systems were first developed, manufacturerstypically built large box-shaped housings to hold the many componentsused to build an information handling system. Over time, manufacturersstrove to reduce the size of information handling system housings sothat their reduced footprint had less of an impact in an office or homeenvironment. Eventually, portable information handling systems enteredthe market with housings sized so that an end user could carry thesystem while in use. Portable information handling systems initiallytended to have reduced capabilities compared with desktop or towerinformation handling systems since the portable housing had to include apower source and integrated display. Manufacturers of portableinformation handling systems tended to use smaller and less capablecomponents, which tended to have smaller footprints and reduced powerconsumption. However, increasing capabilities and decreasing size ofcomponents used to build information handling systems has led to greatercapabilities in portable information handling systems. The improvedcapabilities of portable information handling systems has led to greateracceptance and usage of portable information handling systems so thatend users have recently tended towards selecting portable systems asreplacements for desktop and tower information handling systems.

Manufacturers typically face two substantial challenges whenincorporating more advanced components into portable housings so thatportable information handling system performance approaches that ofdesktop and tower systems: power consumption and cooling. More powerfulprocessing components tend to consume more power when performingincreased numbers of calculations and thus reduce the time that portableinformation handling system can operate on internal power, such as abattery. More powerful processing components also tend to produceadditional heat as a byproduct when performing increased numbers ofcalculations. Cooling components within a portable housing presents achallenge since the reduced size of the housing makes an effectivecooling airflow difficult to achieve. Further, creating a substantialairflow through a portable housing uses additional power and tends togather dust at the cooling vents through which the airflow travels,making the cooling airflow less efficient. One approach used to managepower consumption and heat is to throttle the operation of processingcomponents, such as CPU operating speeds, so that less power is consumedand less heat created. However, throttling processing components reducesthe operating capability of the information handling system. In somesystems, heat generated by processing components, even in a throttledstate, can make a portable information handling system uncomfortable foran end user to hold in his lap. End users sometimes place a heat barrierbeneath the portable information handling system to protect their lapfrom this heat, such as pads, bases or shields that insulate a user'slap from the heat of the information handling system chassis. Someexamples of insulating pads include the Belkin Laptop Cooling Stand, theTargus Notebook Chill Mat, the Zalman NC 1000-B Notebook Cooler and theBelkin Laptosh Cush Case.

SUMMARY OF THE INVENTION

Therefore a need has arisen for a system and method which managesinformation handling system performance based on whether a barrierprotects an end user from heat produced by the information handlingsystem.

A further need exists for a system and method which selectively couplesand decouples a thermal barrier to an information handling system.

In accordance with the present invention, a system and method areprovided which substantially reduce the disadvantages and problemsassociated with previous methods and systems for managing informationhandling system performance. Coupling and uncoupling of a thermalbarrier to an information handling system is detected to select thermalparameters for managing cooling within the information handling system.

More specifically, a thermal manager operating in firmware of aninformation handling system, such as the BIOS, sets thermal parametersfor managing cooling within the chassis of the information handlingsystem based on detection of coupling or uncoupling of a thermal barrierto the bottom of the chassis by a thermal barrier attachment detector.If a thermal barrier is coupled to the base of the information handlingsystem chassis, the thermal manager selects thermal parameters thatallow a higher temperature within the chassis than is allowed without athermal barrier. The higher internal temperature allows the cooling fanto rotate at a slower speed and the CPU to operate at a greater clockspeed since the thermal barrier will protect against passage of excessthermal energy from the bottom of the information handling systemchassis to an end user. Operating the cooling fan at slower rotationspeeds reduces dust and other contaminants from building up within thecooling subsystem of the information handling system so that the coolingsubsystem operates more efficiently for a greater lifetime. Coolingsystem lifetime efficiency is further extended by including a filter inthe thermal barrier.

In another embodiment, a thermal barrier is selectively coupled anddecoupled with an information handling system chassis to selectivelyprovide increased thermal insulation at the bottom of the informationhandling system. The thermal barrier has a base and four sides that forman air channel between the base and the bottom surface of theinformation handling system. A vent formed in a side or the base of thethermal barrier accepts airflow into the air channel which directs theairflow to a vent of the information handling system. A cooling fanoperating in the information handling system pulls air through the airchannel help to keep the base of the thermal barrier cool. In oneembodiment, the bottom surface of the information handling systemchassis has a conductive material to conducts thermal energy to the airchannel. In an alternative embodiment, a heat transfer mechanism extendsthrough the bottom surface of the chassis and into the air channel toaid in the transfer of thermal energy from within the chassis. Ifconductive material is exposed within the air channel, the thermalbarrier integrates with the chassis as a contiguous piece so that an enduser will not be exposed to excessive thermal energy by inadvertentremoval of the thermal barrier. The sides of the thermal barrier sealagainst the chassis to help direct the cooling airflow from the thermalbarrier vent to the cooling fan vent.

The present invention provides a number of important technicaladvantages. One example of an important technical advantage is thatinformation handling system performance is selectively increased if abarrier is detected that protects an end user from heat created by theinformation handling system. By increasing allowed operatingtemperatures, processing component performance may increase for a betterend user experience and cooling subsystem operations may decrease forreduced acoustic noise and power consumption, such as by running acooling fan at a lower speed. Reduced cooling fan operating speedsreduce build of dust in vents for improved long term operations of theinformation handling system. The ability to detect a heat barrier andadjust cooling subsystem operations accordingly allows informationhandling systems to be built smaller, thinner and lighter, giving endusers the option of attaching a heat barrier if greater systemperformance is desired.

Another example of an important technical advantage is that an end userselectively couples and decouples the thermal barrier with the chassisas desired to protect the bottom surface of the information handlingsystem from excess heat or to maintain a compact form. The air channelimproves overall system cooling while reducing thermal energy exposurein areas proximate to an end user. The cooling channel provides anelegant and smooth exterior form for the information handling system andalso provides additional room to add desired features, such as a largercooling fan or additional stiffening for a stronger system housing. Theadditional cooling and reduced release of thermal energy at the bottomsurface of an information handling system is accomplished with minimaladditional height and without powered components, such as additionalfans. A thermal barrier can be added at other areas of the informationhandling system where excessive thermal energy is found, such as a palmrest.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention may be better understood, and its numerousobjects, features and advantages made apparent to those skilled in theart by referencing the accompanying drawings. The use of the samereference number throughout the several figures designates a like orsimilar element.

FIG. 1 depicts a portable information handling system in an openposition and having a thermal barrier aligned to couple to the bottomsurface of its chassis;

FIG. 2 depicts a side view of a portable information handling system ina closed position with a thermal barrier coupled to the bottom surfaceof its chassis;

FIG. 3 depicts a block diagram of a system for managing informationhandling system cooling based on whether a thermal barrier is coupled tothe information handling system;

FIG. 4 depicts a flow diagram of a process for managing informationhandling system cooling based on whether a thermal barrier is coupled tothe information handling system;

FIG. 5 depicts a thermal barrier having sides aligned to seal at thebottom surface of an information handling system chassis;

FIG. 6 depicts a side view of a thermal barrier coupled to aninformation handling system chassis to form an air channel;

FIG. 7 depicts a side view of a thermal barrier integrated with aninformation handling system chassis to form a conductive parallel-wallconvective heat exchanger;

FIG. 8 depicts a side view of a thermal barrier having a heat transfermechanism extending from the chassis bottom surface into the airchannel;

FIG. 9 depicts a cross sectional view of a thermal barrier integratedwith an information handling system chassis having a conductive bottomsurface;

FIG. 10 depicts a cross sectional view of an information handling systemhaving a thermal barrier with a fan assembly that extends from theinformation handling system chassis into the air channel of the thermalbarrier; and

FIG. 11 depicts a side perspective view of an information handlingsystem chassis having an integrated thermal barrier with plural ventlocations.

DETAILED DESCRIPTION

For purposes of this disclosure, an information handling system mayinclude any instrumentality or aggregate of instrumentalities operableto compute, classify, process, transmit, receive, retrieve, originate,switch, store, display, manifest, detect, record, reproduce, handle, orutilize any form of information, intelligence, or data for business,scientific, control, or other purposes. For example, an informationhandling system may be a personal computer, a network storage device, orany other suitable device and may vary in size, shape, performance,functionality, and price. The information handling system may includerandom access memory (RAM), one or more processing resources such as acentral processing unit (CPU) or hardware or software control logic,ROM, and/or other types of nonvolatile memory. Additional components ofthe information handling system may include one or more disk drives, oneor more network ports for communicating with external devices as well asvarious input and output (I/O) devices, such as a keyboard, a mouse, anda video display. The information handling system may also include one ormore buses operable to transmit communications between the varioushardware components.

Referring now to FIG. 1, a portable information handling system 10 isdepicted in an open position and having a thermal barrier 12 aligned tocouple to the bottom surface of its chassis 14. Chassis 14 has a bottomportion that supports plural processing components, such as CPU 16, RAM18, hard disk drive 20 and chipset 22, and a lid 24 that supports adisplay 26, such as an integrated liquid crystal display (LCD). Heatgenerated by the processing components within chassis 14 is removed by acooling fan 28, which generates a cooling airflow through vents formedin the side and bottom surfaces of chassis 14. The speed at whichcooling fan 28 operates is set by firmware in chipset 22 to preventexcessive internal temperatures within chassis 14 while running coolingfan 28 at a minimal speed to reduce power consumption and acousticnoise. In the example of the portable information handling system 10depicted by FIG. 1, the temperature maintained within chassis 14 is alsokept to a maximum value so that the bottom surface temperature will notbecome uncomfortable for an end user who places portable informationhandling system 10 in her lap. In the event that cooling fan 28 cannotkeep the bottom surface temperature sufficiently low, throttling of CPU16 to operate at slower clock speeds is commanded by the firmware toreduce the heat produced by CPU 16 and thus the amount of thermal energythat cooling fan 28 must remove from within chassis 14.

Although CPU throttling will help maintain a comfortable temperature atthe bottom surface of chassis 14, CPU throttling also reduces theperformance of information handling system 10. In order to improveinformation handling system performance by reducing the need for CPUthrottling to maintain a comfortable temperature at the bottom ofchassis 14, thermal barrier 12 couples to the bottom surface of chassis14 to reduce the amount of thermal energy passed from chassis 14 to anend user. Thermal barrier 12 is, for instance, a hollow or insulatedpiece sized to align and couple with the bottom surface of chassis 14.Alternatively, thermal barrier 12 provides additional functions toinformation handling system 12, such as an external attachable batteryslice or media slice having an optical drive. In the embodiment depictedby FIG. 1, a fan filter 30 is integrated in thermal barrier 12 so thatcooling airflow pulled by fan 28 into chassis 14 is filtered beforeentering chassis 14. Fan filter 30 is removable for cleaning so thatcaptured dust does not slow cooling airflow. By capturing contaminantsthat would otherwise enter chassis 14, fan filter 30 prevents cloggingof cooling elements within chassis 14, which can decrease the efficiencyof cooling elements forcing greater CPU throttling and fan speeds. Anattachment indicator 32 aligns with an attachment detector 34 so thatfirmware in chipset 22 detects whether or not thermal barrier 12 iscoupled to chassis 14. Thermal parameters are selected for managingcooling within chassis 14 based on whether or not thermal barrier 12 iscoupled to the bottom of chassis 14. For example, internal operatingtemperatures are increased if thermal barrier 12 is coupled to chassis12, thus reducing the need for CPU throttling and increasing performanceof information handling system 10.

Referring now to FIG. 2, a side view depicts a portable informationhandling system 10 in a closed position with a thermal barrier 12coupled to the bottom surface of its chassis 14. Attachment indicator 32inserts into attachment detector 34 to communicate the presence ofthermal barrier coupled to chassis 14. For example, attachment indicator32 may insert a pin into a switch of attachment detector 34 to indicatethe coupling of thermal barrier 12. Alternatively, attachment indicator32 may communicate identification information to attachment detector 34to identify the type of thermal barrier 12 that is coupled to chassis14. For example, identification information provided by thermal barrier12 indicates the degree of insulation provided by thermal barrier 12 sothat thermal parameters for operating with different types of thermalbarriers are applied by information handling system 10 to preventexcessive heat at the bottom surface of thermal barrier 12. Thermalbarrier 12 increases the height of information handling system 10 in theclosed position, making information handling system 10 less portablewhen attached. Thus, an end user has the option to attach thermalbarrier 12 when greater information handling system performance isdesired and to remove thermal barrier 12 when greater portability isdesired.

Referring now to FIG. 3, a block diagram depicts a system for managinginformation handling system cooling based on whether a thermal barrieris coupled to the information handling system. Firmware instructions ina Basic Input/Output System (BIOS) 36 include thermal barrier attachmentdetector 34, which detects attachment of a thermal barrier to aninformation handling system and signals the attachment to a thermalmanager 37. Thermal manager 37 selects thermal parameters for use inoperation of the information handling system from a thermal parametertable 38 and commands operation of CPU 16 and fan 28 according to theselected thermal parameters. If a thermal barrier is detected by thermalbarrier attachment detector 34, then thermal manager 37 selects thermalparameters from thermal parameter table 38 to allow an increasedoperating temperature so that CPU 16 operates at relatively higher clockspeeds and fan 28 operates at relatively lower rotation speeds. If nothermal barrier is detected, thermal manager 37 selects thermalparameters from thermal parameter table 38 for normal operatingconditions so that CPU 16 operates at a relatively lower clock speed andfan 28 operates at a relatively higher rotation speed. In oneembodiment, an identifier provided by thermal barrier attachmentdetector 34 to thermal manager 37 allows selection of thermal parametersbased upon the relative insulation provided by the thermal barrier. Forexample, a battery or optical drive thermal slice might provide lessinsulation than a thermal slice designed specifically for blockingtransfer of thermal energy.

Referring now to FIG. 4, a flow diagram depicts a process for managinginformation handling system cooling based on whether a thermal barrieris coupled to the information handling system. The process begins atstep 40 with power up of the information handling system. At step 42, adetermination is made of whether a thermal barrier is attached to theinformation handling system. If no, the process continues to step 44 toload normal thermal parameters for managing cooling of the informationhandling system. If yes, the process continues to step 46 to loadenhanced thermal parameters for managing cooling of the informationhandling system with elevated internal operating temperatures. At step48, the information handling system operates at normal parameters and,at step 50, the information handling system operates with enhancedthermal parameters. Periodically, the process continues to step 52 todetermine if a status change has occurred, such as the coupling oruncoupling of the thermal barrier to the information handling system. Ifthe thermal barrier status remains unchanged the process continues tostep 48 or 50 based on the status of the thermal barrier coupling. If astatus change has occurred in the coupling or uncoupling of the thermalbarrier, the process returns to step 42 to determine if the thermalbarrier is attached. For example, the information handling system isrebooted to reset the thermal parameters in the firmware.

Referring now to FIG. 5, a thermal barrier 12 is depicted having sides56 aligned to seal at the bottom surface 58 of an information handlingsystem chassis 14. In the example embodiment depicted by FIG. 5, thermalbarrier 12 has a rectangular shape with four sides 56 and a base 50 thatform an air channel 62 when sides 56 couple at the outer perimeter ofchassis bottom surface 58. A coupling system 64, depicted in the exampleembodiment as hooks extending from sides 56, couples thermal barrier 12to chassis 14, such as by engaging hooks 64 into coupling system slots66, so that sides 56 seal air channel 62 about the perimeter of bottomsurface 58. Cooling airflow is pulled through air channel 62 as depictedby arrows 68 by a cooling fan running in information handling system 10that pulls air through a chassis vent opening 70. Airflow 68 enters airchannel 62 through a side vent opening 72 located in a side 56 at theopposite end of information handling system 10 relative to the locationof chassis vent opening 70. Locating thermal barrier vent 72 at anopposite end of information handling system 10 relative to chassis vent70 causes airflow 68 to travel across substantially all of the length ofair channel 62 to help cool base 60 which is design to rest on an enduser's lap.

Referring now to FIG. 6, a side view depicts a thermal barrier 12coupled to an information handling system chassis 14 to form an airchannel 62. Air channel 62 provides insulation for thermal energyreleased from chassis 14 through the bottom surface 58, where an enduser might come in contact with the thermal energy, such as when restinginformation handling system 10 in the end user's lap. Air flow 68passing through air channel 62 helps to cool the base 60 of thermalbarrier 12. Attaching thermal barrier 12 to chassis 14 increases theoverall height of information handling system 10, making the system morebulky and perhaps more difficult to physically manage. However, an enduser can selectively couple or decouple thermal barrier 12 to haveeither improved cooling at base 60 or improved mobility, depending onthe preference of the end user. Selectively coupling and decoupling ofthermal barrier 12 provides an end user with flexibility to alter thephysical characteristics of information handling system 10, such assize, weight, and thermal characteristics, as well as operatingcharacteristics, such as fan speed and CPU cycles. However, thermalbarrier 12 may also permanently couple to information handling system 10by integration of thermal barrier 12 in the housing of informationhandling system 10.

Referring now to FIG. 7, a side view depicts a thermal barrier 12integrated with an information handling system chassis 14 to form aconductive parallel-wall convective heat exchanger. Airflow entersthrough inlet venting 72 formed in the base 60 of thermal barrier 12 topass through air channel 62, into fan 28 and out an exhaust 76 formed inthe side of chassis 14. Thermal energy transfer from processingcomponents, such as CPU 16, to the cooling airflow is enhanced with aheat pipe 74 that conducts thermal energy into the path of the coolingairflow, such as through a heat exchanger 80 disposed in exhaust 76. Aconductive material 82 forms the bottom surface 58 of chassis 14 andconducts thermal energy from within chassis 14 to air channel 62 to aidin the removal of thermal energy from within chassis 14. In the exampleembodiment depicted by FIG. 7, thermal barrier 12 is integrated withchassis 14 as a contiguous component so that thermal barrier 12 is notremoved to expose conductive material 82 to an end user. The relativelylarge surface area of conductive material 82 across the length of airchannel 62 provides an increased opportunity for the exchange of thermalenergy.

Referring now to FIG. 8, a side view depicts a thermal barrier 12 havinga heat transfer mechanism 84 extending from the chassis bottom surface58 into air channel 62. heat sink mechanism 84 is a conductive materialhaving mass that aids in the absorbing of thermal energy from withinchassis 14. Heat sink mechanism 84 couples directly to a component, suchas memory, to absorb heat from the component and transfers the heat tofins 86 that provide additional surface area for transfer of thermalenergy to air channel 62. In alternative embodiments, heat sinkmechanism 84 couples to multiple components through heat pipes or otherthermally conductive materials. In the example embodiment depicted byFIG. 8, thermal barrier 12 integrates into chassis 14 to form acontiguous piece so that thermal barrier 12 will not separate fromchassis 14 to expose heat sink mechanism 84 to an end user. Inalternative embodiments, heat sink mechanism 84 retracts into chassis 14during operation of information handling system 10 with thermal barrier12 removed. Extending heat exchanging mechanisms into air channel 62provides greater flexibility in the design placement of components withreduced reliance on heat pipes and other types of thermal transfermechanisms because components are more easily cooled in variouslocations of chassis 14. In other words, component layout is lessinfluenced by the need to achieve adequate cooling so that componentlayouts may be selected, for instance, to reduce the footprint orvertical height of information handling system 10.

Referring now to FIG. 9, a cross sectional view depicts a thermalbarrier 12 integrated with an information handling system chassis 14having a conductive bottom surface 58. Bottom surface 58 of chassis 14has a conductive material 82 exposed across a wide surface area alongthe length of air channel 62. Pulling cooling airflow from an inlet 72to an exhaust 76 located at opposing ends of the chassis 14 aids heattransfer from conductive material 82 by having the airflow exposed toconductive material 82 across the length of chassis 14. Air channel 62provides insulation against transfer of thermal energy to base 60 ofthermal barrier 12 to minimize heat felt by an end user in contact withbase 60. Base 60 can include an insulating material to further reduceheat transfer to base 60. Integration of thermal barrier 12 into chassis14 provides a compact system that minimizes the space needed to add airchannel 62 since coupling and de-coupling will not take place by an enduser.

Referring now to FIG. 10, a cross sectional view depicts an informationhandling system 10 having a thermal barrier 12 with a fan assembly 88that extends from the information handling system chassis 14 into theair channel 62 of the thermal barrier 12. Air channel 62 provides roomfor the expansion of components where needed while providing a bottomsurface at base 60 having reduced thermal energy and also smooth andfree of physical discontinuities. In the example embodiment depicted byFIG. 10, fan assembly 88 that contains fan 28 extends into air channel62 to improve airflow from air channel 62 to fan 28. The ability toaccept a larger fan assembly by expanding into air channel 62 providesincreased cooling performance with lower acoustics.

Referring now to FIG. 11, a side perspective view depicts an informationhandling system chassis having an integrated thermal barrier with pluralvent locations. The chassis bottom surface and base 60 form aparallel-wall thermal barrier 12 integrated into chassis 14 as acontiguous unit. Air flow pulled by a fan from side vent openings 72through chassis vent opening 70 helps to prevent conduction of thermalenergy by processing components located above chassis bottom surface 58to base 60, thus maintaining base 60 at a reduced temperature. Theparallel wall structure formed by base 60 and chassis bottom surface 58provides insulation against transfer of thermal energy, which is furtheraided by the cooling airflow drawn through the air channel structureduring operation of a fan to pull air through chassis vent opening 60.Integration of thermal barrier 12 with chassis 14 into a singlecontiguous part allows the projection of heat transfer devices or evenprocessing components into the air channel formed between base 60 andchassis bottom surface 58 to enhance cooling, such as is depicted byFIG. 8. For instance, having thermal barrier permanently coupled tochassis 14 so that an end user cannot select to remove thermal barrier12 reduces the risk of injury to the end user by contact to heatedparts. In some instances, thermal barrier 12 is permanently coupled withscrews or similar devices so that a technician can access componentsthrough chassis bottom surface 58 while access is restricted by endusers. In an example embodiment, chassis bottom surface 58 is made ofthermally conductive material, such as a metal, that helps to conductthermal energy from within chassis 14 to the cooling airflow within theair channel defined by thermal barrier 12, while base 60 is made of amaterial having limited thermal conductivity, such as a thermoplastic toenhance insulation against thermal energy proceeding from chassis 14through base 60. FIG. 11 depicts plural side vent openings formed inthermal barrier 12 to draw cooling airflow into the air channel fromdifferent locations. For example, one opening 72 is formed proximate toa memory heat sink and another larger opening 72 is located proximate aCPU heat sink so that a cooling airflow of varying intensity is pulldirectly across each heat sink. Alternatively, multiple openings 72 maybe placed around the outer edge of thermal barrier 12 to provide adesired airflow through the air channel of thermal barrier 12.

Although the present invention has been described in detail, it shouldbe understood that various changes, substitutions and alterations can bemade hereto without departing from the spirit and scope of the inventionas defined by the appended claims.

1. An information handling system comprising: a chassis having a bottomsurface and a base integrated together by four sides to form anintegrated thermal barrier, one or more of the sides having ventopenings; plural processing components disposed in the chassis andoperable to process information; and a fan disposed in the chassis andoperable to generate an airflow from a fan vent formed in the bottomsurface to draw air through the thermal barrier side vent opening. 2.The information handling system of claim 1 wherein the fan vent islocated proximate a first end of the chassis and at least one of thethermal barrier vent openings is located proximate an opposing end ofthe chassis so that the airflow between the fan vent and the thermalbarrier vent travels substantially from the first end to the opposingend.
 3. The information handling system of claim 1 further comprising aheat transfer device extending from a processing component through thechassis bottom surface and into the air channel.
 4. The informationhandling system of claim 1 wherein the thermal barrier has plural sideopenings, at least one of the side openings located proximate a heattransfer device.
 5. The information handling system of claim 1 whereinthe thermal barrier base comprises a material operable to insulate heatfrom the chassis passing out the base.
 6. The information handlingsystem of claim 1 wherein the chassis bottom surface comprises athermally-conductive material operable to conduct heat from the chassisinto the air channel.
 7. The information handling system of claim 1wherein the fan extends through the chassis bottom surface and into thethermal barrier.
 8. The information handling system of claim 1 whereinthe thermal barrier sides and chassis bottom surface are sealed to forman air channel within the thermal barrier.
 9. A method for managingcooling of an information handling system, the method comprising:integrating a thermal barrier at the bottom surface of a chassis of theinformation handling system to form an air channel, the thermal barrierhaving a thermal barrier vent; and pulling an airflow from the thermalbarrier vent through the air channel and into the information handlingsystem.
 10. The method of claim 9 further comprising: disposing athermally conductive material in the air channel; and conducting heatfrom the information handling system through the thermally conductivematerial into the airflow through the air channel.
 11. The method ofclaim 9 further comprising: extending a heat sink from a processingcomponent of the information handling system through the bottom surfaceand into the air channel; and conducting heat through the heat sink intothe airflow through the air channel.
 12. The method of claim 11 furthercomprising: forming plural vent openings in the thermal barrier, atleast vent opening proximate to the heat sink; and drawing air inthrough the vent openings, at least some air passing proximate the heatsink.
 13. The method of claim 9 wherein coupling a thermal barrierfurther comprises: sealing the thermal barrier against the chassisbottom surface so that air is drawn substantially only through thethermal barrier vent into the chassis.
 14. The method of claim 13further comprising drawing air into the chassis from the thermal barrierwith a fan through a fan vent formed in the chassis bottom surface. 15.The method of claim 9 wherein pulling an airflow further comprisespulling air into the information handling system through a system ventlocated in the chassis bottom surface at a first end of the informationhandling system, the thermal barrier vent located at an opposing end ofthe information handling system.
 16. The method of claim 9 whereinpulling an airflow further comprises pulling air into the informationhandling system with a fan assembly that extends through the chassisbottom surface of the information handling system and into the airchannel.
 17. An information handling system chassis comprising: achassis bottom surface having a chassis vent opening; and a thermalbarrier having a base and four sides, the four sides integrated with thebottom surface as a contiguous unit to form an air channel between thebase and the bottom surface, the thermal barrier having at least onevent opening.
 18. The system of claim 17 further comprising a heat sinkextending through the chassis bottom surface and into the air channel,the heat sink operable to transfer thermal energy from the chassis intothe air channel.
 19. The system of claim 18 wherein the thermal barrierhas plural vent openings, at least one vent opening located proximatethe heat sink.
 20. The system of claim 17 wherein the chassis bottomsurface comprises a thermally conductive material and the thermalbarrier comprises a thermally insulative material.